1.Dual-Sided Copper Cladding: Conductive copper foil on both top and bottom of the insulating substrate.
2.Plated Through-Holes (PTHs): Enable electrical connection between the two copper layers for signal/current transmission.
3.Balanced Performance-Cost: Higher component density and routing flexibility than single-sided PCBs, yet more cost-effective than multi-layer PCBs.
4.Moderate Component Density: Supports more components (e.g., SMDs, through-hole parts) than single-sided PCBs, suitable for devices needing moderate functional integration without the complexity of multi-layer boards.
5.Flexible Routing: Reduces wire crossing issues via two-layer routing, simplifying the layout of signal and power circuits for better performance.
6.Wider Application Adaptability: Compatible with diverse electronic devices across consumer, industrial, automotive, and medical fields due to its balanced cost and functionality.
Documents required for custom double-sided PCBs:
Please send us your:
1. Gerber files (RS-274X)
2. BOM (if PCBA needed)
3. Impedance requirements & stack-up (if available)
4.Test requirements (TDR, network analyzer, etc.)
Noted:Normally,Gerber files includes: PCB type,thickness, ink color, surface treatment process, and if SMT processing is required, you can provide a component BOM and reference designation diagram, etc.
We’ll reply within 24 hours with a free quote, DFM report, and material recommendation.
Custom Double-Sided PCB Manufacturing Process
1. Design & DFM Optimization: Develop detailed circuit layout using professional CAD software; conduct Design for Manufacturability analysis to optimize trace width, hole size and spacing, ensuring compliance with custom requirements and production feasibility.
2. Core Board Fabrication: Cut copper-clad laminate to target size; etch circuits on both sides via photolithography; drill vias and perform metallization to achieve reliable interlayer electrical connection.
3. Surface Finishing & Marking: Apply solder mask for insulation and corrosion resistance; print silkscreen (component labels, logos); conduct surface treatment (ENIG, HASL, etc.) based on needs.
4. Quality Control & Delivery: Carry out AOI inspection and electrical testing to eliminate defective boards; cut to final dimensions, package and deliver to customers.
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